S. Wickramanayaka: search on Z-Library

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1

Heterogeneous 2.5D integration on through silicon interposer

Zhang, Xiaowu, Lin, Jong Kai, Wickramanayaka, Sunil, Zhang, Songbai, Weerasekera, Roshan, Dutta, Rahul, Chang, Ka Fai, Chui, King-Jien, Li, Hong Yu, Wee Ho, David Soon, Ding, Liang, Katti, Guruprasad,

Journal:

Applied Physics Reviews

Year:

2015

Language:

english

File:

PDF, 20.59 MB

english, 2015

2

Aluminium and cooking

TENNAKONE, K., WICKRAMANAYAKA, S.

Journal:

Year:

1987

File:

PDF, 143 KB

1987

3

Atomic hydrogen-induced chemical vapor deposition of a-Si:C:H thin-film materials from alkylsilane precursors

Wróbel, A.M., Wickramanayaka, S., Nakanishi, Y., Hatanaka, Y., Pawłowski, S., Olejniczak, W.

Journal:

Diamond and Related Materials

Year:

1997

Language:

english

File:

PDF, 2.01 MB

english, 1997

4

Al-Ge Diffusion Bonding for Hermetic Sealing Application

Chidambaram, Vivek, Wickramanayaka, Sunil

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 1.13 MB

english, 2015

5

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Comparison of aluminum post etch cleaning on MEMS structures using formulated organic solvent cleaners

Steven, Lee Hou Jang, Bliznetsov, Vladimir, Wei, Deng, Dexian, Tham, Wickramanayaka, Sunil

Year:

2014

Language:

english

File:

PDF, 845 KB

english, 2014

6

[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Mitigation of thin wafer handling issues in TSV (Through Silicon Via) fabrication for advanced packaging applications

Sekhar, V. N., Qin, Ren, Wickramanayaka, Sunil

Year:

2016

File:

PDF, 498 KB

2016

7

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Stealth Dicing Challenges for MEMS Wafer Applications

Cereno, Daniel Ismael, Wickramanayaka, Sunil

Year:

2017

Language:

english

File:

PDF, 627 KB

english, 2017

8

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Study on warpage and stress of TSV wafer with ultra-fine pitch vias for high density chip stacking

Che, F.X., Xie, L., Chen, Z.H., Wickramanayaka, Sunil

Year:

2017

Language:

english

File:

PDF, 1.54 MB

english, 2017

9

Structure–Property Relationships of Amorphous Hydrogenated Silicon–Carbon Films Produced by Atomic Hydrogen–Induced CVD from a Single-Source Precursor

A. M. Wróbel, S. Wickramanayaka, K. Kitamura, Y. Nakanishi, Y. Hatanaka

Journal:

Chemical Vapor Deposition

Year:

2000

Language:

english

File:

PDF, 505 KB

english, 2000

10

Cuprous thiocyanate: A superior photocatalyst for oxidation of water

Kirthi Tennakone, Sunil Wickramanayaka, Shamol Basu

Journal:

Chemical Physics Letters

Year:

1985

Language:

english

File:

PDF, 181 KB

english, 1985

11

Biochemical chiral selection in the presence of instabilities, chaos, and noise

K. Tennakone, S. Wickramanayaka

Journal:

Applied Mathematics and Computation

Year:

1990

Language:

english

File:

PDF, 271 KB

english, 1990

12

Growth of ZnSe thin films by radical assisted MOCVD method

T. Aoki, M. Morita, S. Wickramanayaka, Y. Nakanishi, Y. Hatanaka

Journal:

Applied Surface Science

Year:

1996

Language:

english

File:

PDF, 364 KB

english, 1996

13

High-quality amorphous hydrogenated silicon carbide coatings by remote plasma chemical vapor deposition from a single-source precursor

A.M. Wróbel, S. Wickramanayaka, Y. Nakanishi, Y. Hatanaka

Journal:

Journal of Materials Processing Technology

Year:

1995

Language:

english

File:

PDF, 339 KB

english, 1995

14

PVD-HfSiON gate dielectrics with Ni-FUSI electrode for 65nm LSTP application

K. Yamamoto, S. Kubicek, A. Rothschild, R. Mitsuhashi, W. Deweerd, A. Veloso, M. Jurczak, S. Biesemans, S. De Gendt, S. Wickramanayaka, S. Hayashi, M. Niwa

Journal:

Microelectronic Engineering

Year:

2005

Language:

english

File:

PDF, 320 KB

english, 2005

15

On the chemistry of a-SiO2 deposition by plasma enhanced CVD

Sunil Wickramanayaka, Y. Nakanishi, Y. Hatanaka

Journal:

Applied Surface Science

Year:

1997

Language:

english

File:

PDF, 397 KB

english, 1997

16

Variation of the Recombination Coefficient of Atomic Oxygen on Pyrex Glass with Applied RF Power

Wickramanayaka, Sunil, Hosokawa, Naokithi, Hatanaka, Yoshinori

Journal:

Japanese Journal of Applied Physics

Year:

1991

File:

PDF, 753 KB

1991

17

High quality SiO2 depositions from TEOS by ECR plasma

K. Sano, S. Hayashi, S. Wickramanayaka, Y. Hatanaka

Journal:

Thin Solid Films

Year:

1996

Language:

english

File:

PDF, 500 KB

english, 1996

18

Oligomerization and Polymerization Steps in Remote Plasma Chemical Vapor Deposition of Silicon−Carbon and Silica Films from Organosilicon Sources

Wróbel, A. M., Walkiewicz-Pietrzykowska, A., Hatanaka, Y., Wickramanayaka, S., Nakanishi, Y.

Journal:

Chemistry of Materials

Year:

2001

Language:

english

File:

PDF, 190 KB

english, 2001

19

Remote Hydrogen Plasma Chemical Vapor Deposition of Amorphous Hydrogenated Silicon-Carbon Films from an Organosilane Molecular Cluster as a Novel Single-Source Precursor: Structure, Growth Mechanism, and Properties of the Deposit

Wrobel, A. M., Wickramanayaka, S., Nakanishi, Y., Fukuda, Y., Hatanaka, Y.

Journal:

Chemistry of Materials

Year:

1995

Language:

english

File:

PDF, 2.00 MB

english, 1995

20

[IEEE 2005 IEEE VLSI-TSA. International Symposium on VLSI Technology (VLSI-TSA-TECH) - Hsinchu, Taiwan (25-27 April 2005)] IEEE VLSI-TSA International Symposium on VLSI Technology, 2005. (VLSI-TSA-Tech). - Work function engineering of RuHf alloys as gate electrodes for future generation dual metal CMOS

Wen, H.-C., Majhi, P., Alshareef, H., Huffman, C., Choi, K., Lysaght, P., Harris, R., Luan, H., Lee, B.H., Yamada, N., Wickramanayaka, S.

Year:

2005

Language:

english

File:

PDF, 367 KB

english, 2005

21

Oligomerization and Polymerization Steps in Remote Plasma Chemical Vapor Deposition of Silicon-Carbon and Silica Films from Organosilicon Sources.

Wróbel, A. M., Walkiewicz-Pietrzykowska, A., Hatanaka, Y., Wickramanayaka, S., Nakanishi, Y.

Journal:

Chemistry of Materials

Year:

2001

Language:

english

File:

PDF, 9 KB

english, 2001

22

Electrical properties of amorphous high-/spl kappa/ HfTaTiO gate dielectric with dielectric constants of 40-60

Lu, N., Li, H.-J., Gardner, M., Wickramanayaka, S., Kwong, D.-L.

Journal:

IEEE Electron Device Letters

Year:

2005

Language:

english

File:

PDF, 224 KB

english, 2005

23

Optimization of plasma density and radial uniformity of a point-cusp magnetic field applied capacitive plasma

Wickramanayaka, Sunil, Nakagawa, Yukito, Sago, Yasumi, Numasawa, Yoichiro

Journal:

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Year:

2000

Language:

english

File:

PDF, 372 KB

english, 2000

24

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Effect of Cu seed layer aging on Cu filling failure in through Si vias (TSVs)

Choi, Jae Woong, Guan, Ong Lee, Yingjun, Mao, Jielin, Xie, Lan, Chow Choi, Kim, Soon-Wook, Murthy, Ramana, Swee Kiat, Eugene Tan, Wickramanayaka, Sunil

Year:

2013

File:

PDF, 600 KB

2013

25

Characterization of thermodynamically non-equilibrium high-temperature oxygen plasma downstream region

Wickramanayaka, Sunil, Meikle, S., Sekiguchi, A., Hosokawa, M., Hatanaka, Y.

Journal:

Journal of Applied Physics

Year:

1991

Language:

english

File:

PDF, 573 KB

english, 1991

26

Remote hydrogen plasma chemical vapor deposition using an organopentasilane cluster as a novel film-forming precursor: Mechanism of the activation step

Wrobel, A. M., Wickramanayaka, S., Hatanaka, Y.

Journal:

Journal of Applied Physics

Year:

1994

Language:

english

File:

PDF, 855 KB

english, 1994

27

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking

Xie, Ling, Wickramanayaka, Sunil, Li, Hongyu, Jung, Boo Yang, Aw, Jie Li, Chong, Ser Choong

Year:

2013

Language:

english

File:

PDF, 4.02 MB

english, 2013

28

Relationship between hydrogenation and optical properties of dielectric a-SiC:H films prepared by tetrakis(trimethylsilyl)silane in remote H2 plasma

Wickramanayaka, Sunil, Nakanishi, Yoichiro, Hatanaka, Yoshinori

Journal:

Journal of Applied Physics

Year:

1995

Language:

english

File:

PDF, 998 KB

english, 1995

29

Preparation and Deposition Mechanism of a-SiC:H Films by Using Hexamethyldisilane in a Remote H[sub 2] Plasma

Wickramanayaka, Sunil

Journal:

Journal of The Electrochemical Society

Year:

1994

Language:

english

File:

PDF, 584 KB

english, 1994

30

[ACM Press the SIGCHI Conference - Boston, MA, USA (2009.04.04-2009.04.09)] Proceedings of the 27th international conference on Human factors in computing systems - CHI 09 - StoryBank

Frohlich, David M., Rachovides, Dorothy, Riga, Kiriaki, Bhat, Ramnath, Frank, Maxine, Edirisinghe, Eran, Wickramanayaka, Dhammike, Jones, Matt, Harwood, Will

Year:

2009

Language:

english

File:

PDF, 976 KB

english, 2009

31

Downstream Gas Temperature Variation of Glow and Plasmoidal Oxygen Radio Frequency Discharges

Wickramanayaka, Sunil, Hatanaka, Yoshinori, Jimba, Hitoshi, Hosokawa, Naokichi

Journal:

Japanese Journal of Applied Physics

Year:

1992

Language:

english

File:

PDF, 204 KB

english, 1992

32

Magnetically Enhanced Dual Frequency Capacitively Coupled Plasma Source for Large-area Wafer Processing

Wickramanayaka, Sunil, Nakagawa, Yukito

Journal:

Japanese Journal of Applied Physics

Year:

1998

Language:

english

File:

PDF, 806 KB

english, 1998

33

Measurements of Power Absorption in a Modified Magnetron-type Discharge

Wickramanayaka, Sunil, Takagi, Ken-ichi, Nakagawa, Yukito, Tsukada, Tsutomu, Sato, Noriyoshi

Journal:

Japanese Journal of Applied Physics

Year:

1997

Language:

english

File:

PDF, 1009 KB

english, 1997

34

Variation of Radial Plasma Density Profile with the Excitation Frequency in a Magnetron-Type Plasma

Wickramanayaka, Sunil, Li, Yunlong, Iizuka, Satoru, Takagi, Ken-ichi, Nakagawa, Yukito, Tsukada, Tsutomu, Sato, Noriyoshi

Journal:

Japanese Journal of Applied Physics

Year:

1998

Language:

english

File:

PDF, 315 KB

english, 1998

35

Remote Plasma S i O 2 Deposition by Tetraethoxysilane with Chemically and Energetically Different Atomic Species

Wickramanayaka, Sunil, Matsumoto, Akinori, Nakanishi, Yoichiro, Hosokawa, Naokichi, Hatanaka, Yoshinori

Journal:

Japanese Journal of Applied Physics

Year:

1994

File:

PDF, 1.28 MB

1994

36

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Effect of process pressure on PVD AlN thin film

Xie, J. L., Wickramanayaka, Sunil

Year:

2014

Language:

english

File:

PDF, 186 KB

english, 2014

37

The Current Political Situation in Sri Lanka: A Vision for the Future

Wickramanayaka, Ratnasiri

Journal:

Israel Journal of Foreign Affairs

Year:

2008

Language:

english

File:

PDF, 841 KB

english, 2008

38

Deposition of High Quality SiO2 Films Using Teos by ECR Plasma

Sano, K., Tamamaki, H., Nomura, M., Wickramanayaka, S., Nakanishi, Y., Hatanaka, Y.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 323 KB

english, 1995

39

Melting Evaporation and Recrystallization of A-Sic:H Films by Excimer Laser

Wickramanayaka, S., Kitamura, K., Nakanishi, Y., Hatanaka, Y.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 855 KB

english, 1995

40

Evaluation Of Reaction Dynamics Of Film Depositions In Plasma Cvds By Using A Remote Plasma Cvd System

Wickramanayaka, S., Kitamura, K., Nakanishi, Y., Hatanaka, Y.

Journal:

MRS Proceedings

Year:

1995

Language:

english

File:

PDF, 321 KB

english, 1995

41

Deposition of Thin SiO2 Films on Polymers as a Hard – Coating using a Microwave – ECR Plasma

Sano, K., Tamamaki, H., Nomura, M., Wickramanayaka, S., Nakanishi, Y., Hatanaka, Y.

Journal:

MRS Proceedings

Year:

1996

Language:

english

File:

PDF, 1.61 MB

english, 1996

42

Seed-layer Deposition for Sub 0.25 µm Cu Metallization Using a Line Cusp Magnetron Plasma Source

Wickramanayaka, Sunil, Nagahama, Hanako, Watanabe, Eisaku, Hayashi, Toshihiko, Sato, Makoto, Nakagawa, Yukito, Hasegawa, Shinya, Mizuno, Shigeru, Numasawa, Yoichiro

Journal:

MRS Proceedings

Year:

2000

Language:

english

File:

PDF, 1.81 MB

english, 2000

43

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking

Xie, Ling, Wickramanayaka, Sunil, Jung, Boo Yung, Li, Jerry Aw Jie, Jung-kai, Lim, Ismael, Daniel

Year:

2014

Language:

english

File:

PDF, 4.46 MB

english, 2014

44

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - High-Throughput Thermal Compression Bonding of 20 um Pitch Cu Pillar with Gas Pressure Bonder for 3D IC Stacking

Xie, Ling, Wickramanayaka, Sunil, Chong, Ser Choong, Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael

Year:

2016

Language:

english

File:

PDF, 911 KB

english, 2016

45

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - 6um Pitch High Density Cu-Cu Bonding for 3D IC Stacking

Xie, Ling, Wickramanayaka, Sunil, Chong, Ser Choong, Sekhar, Vasarla Nagendra, Ismeal, Daniel, Ye, Yong Liang

Year:

2016

Language:

english

File:

PDF, 2.22 MB

english, 2016

46

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Chip to wafer hermetic bonding with flux-less reflow oven

Wai, Leong Ching, Nachiappan, Vivek Chidambaram, Wickramanayaka, Sunil, Oetzel, Christoph

Year:

2016

Language:

english

File:

PDF, 846 KB

english, 2016

47

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application

Chong, Ser Choong, Xie, Ling, Wickramanayaka, Sunil, Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael

Year:

2016

Language:

english

File:

PDF, 529 KB

english, 2016

48

[IEEE 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2016.11.30-2016.12.3)] 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) - Development of wafer level laminated magnetic thin film for integrated voltage regulator application

Yu, Jun, Arasu, Muthukumaraswamy Annamalai, Wickramanayaka, Sunil

Year:

2016

File:

PDF, 339 KB

2016

49

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Study of C2W Bonding Using Cu Pillar with Side-Wall Plated Solder

Xie, Ling, Wickramanayaka, Sunil, Sekhar, Vasarla Nagendra, Cereno, Daniel Ismael

Year:

2017

Language:

english

File:

PDF, 901 KB

english, 2017

50

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Thin-Film Magnetic Inductor for Integrated Power Management

Muthukumaraswamy, Annamalai Arasu, Chui, King Jien, Lim, Wei Yi, Yu, Jun, Soh, Serine, Wing, Leong Yew, Lin, Huamao, Wickramanayaka, Sunil

Year:

2017

Language:

english

File:

PDF, 883 KB

english, 2017